We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Implementation Services.
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Implementation Services Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Implementation Services Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications
  2. ジャパンギャルズSC 東京オフィス Tokyo//others
  3. 松本加工 Shizuoka//Resin/Plastic
  4. 4 TKR Tokyo//Consumer Electronics
  5. 5 平和電機 Kyoto//Electronic Components and Semiconductors

Implementation Services Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Japan Gals Inc. Business Introduction ジャパンギャルズSC 東京オフィス
  2. OKI JIP Corporation - Company Profile 沖電気工業 産業営業本部 産業営業統括室
  3. OKI Circuit Technology Implementation Services 沖電気工業 産業営業本部 産業営業統括室
  4. Waterproof insulation for substrates and electrical components. Sample gift of "hot melt molding." 松本加工
  5. 4 Delivery possible in as short as 1 day! PCB assembly service that also supports small-scale production. 平和電機

Implementation Services Product List

1~15 item / All 127 items

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Multi-chip packaging service

We'll get started right after your consultation! We will implement the circuit board quickly with high positional accuracy!

Our service achieves high positional accuracy and speedy PCB assembly using the Daibonder DM60M-H. Even difficult-to-handle chips are optimally managed by our experienced staff. 【Features】 ■ Achieves high positional accuracy with chips ranging from one to six varieties. This service is advantageous when it is necessary to align optical centers. ■ High productivity is realized due to single transport. Simultaneous assembly of up to six varieties with one PCB recognition. ■ Investment can be minimized during small-scale production. We have a manufacturing line that specializes in small-scale production. You can use only the necessary amount of materials we have in-house. ■ We provide design know-how to achieve the above. For example, know-how for designing production jigs and bonding conditions for equipment, etc. We also accept inquiries related to optical characteristics.

  • Circuit board design and manufacturing
  • LED Module
  • Other optical parts

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MiniLED implementation service

Support from substrate design! Introduction of high-density MiniLED mounting services.

Our company offers "MiniLED implementation services" used for high-definition applications in backlighting. There are various implementation needs depending on the dimensions of the backlight. We mainly use APC for implementation. 【Features】 ■ Compatible with thin materials such as FPC. ■ Assistance with design changes to accommodate sizes suitable for large substrates. ■ We accept orders starting from a single piece. *For more details, a separate meeting is required, but please feel free to contact us.

  • LED Module
  • diode
  • Other electronic parts

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Syspro Mach delivery

A must-see for engineers pressed for development deadlines! Are you giving up, thinking "I can't make the deadline anymore"?

The "SysProMach Service" is a service that can accommodate weekends and enable ultra-fast implementation. In a case of response, after ultra-short delivery time PCB design, a 6-layer through-hole PCB was manufactured in just two days on Thursday and Friday, and assembled in two days over the weekend. It was possible to deliver as early as Monday. To all engineers who have given up thinking, "I can't meet the deadline anymore," please leave it to us. 【Express Service Examples】 ■ 6-layer through-hole PCB manufactured in two days on Thursday and Friday ■ Assembled in two days over the weekend ■ Delivered as early as Monday *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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High-Density Implementation Products [Contract Design and Manufacturing Examples]

Designed based on the principle that 'the quality, performance, and cost of a product can be designed.' One-stop contract manufacturing service from product planning and prototyping to mass production.

Our company assists customers from the product planning and design stage with an eye towards mass production. [Example] ■Supports BGA and 0402 size *For more details, please download the materials or feel free to contact us.

  • Circuit board design and manufacturing

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Flip chip assembly contract service

Flip chip assembly contract service

We offer a contract assembly service specialized in flip chip assembly that can achieve high-density implementation at low cost. We support prototype flip chip assembly from rigid substrates to COF, COG substrates, and Si interposer substrates, as well as 3D assembly prototypes using TSV electrodes.

  • Other analyses
  • Contract measurement
  • Processing Contract

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Flip chip assembly prototyping service

We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.

We provide total solution services from circuit design necessary for flip chips, bump and re-routing processing, wafer back grinding and dicing, flip chip mounting, to reliability joint evaluation, as well as sales of next-generation flip chip mounting machines.

  • Bonding Equipment
  • Contract manufacturing

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Slim LED stand panel

Slim LED stand panel

The ultra-thin LED stand panel is an easy light panel that allows for image changes at any time. The energy-efficient and environmentally friendly next-generation LED light panel is perfect for exhibitions, interior design, and other spatial presentations. It is sure to enhance advertising effectiveness! Assembly is a breeze, and you can easily start displaying at any time! With a design that significantly reduces power consumption, it is a great product that is kind to both your wallet and the environment.

  • Company:ウェル
  • Price:10,000 yen-100,000 yen
  • Other electronic parts

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Special substrate mounting service

Leave the difficult substrate assembly, such as high multilayer and high current boards, flexible boards, and aluminum boards, to us.

For the implementation of special substrates and components for which no spares can be prepared, prior arrangements are extremely important. We propose suitable solutions regarding temperature conditions and implementation methods. In particular, we have accumulated know-how on profiles suitable for various types of substrates. Leave the implementation of difficult substrates, such as high-layer, high-current substrates, flexible substrates, and aluminum substrates, to us. 【Examples】 ■ Struggling with the implementation of thick substrates ■ Wanting to implement on an extra-large substrate (external dimensions 1m square) that cannot be fed into a reflow or mounter *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing

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Implementation service

From procurement of materials to assembly and inspection.

We offer a wide range of services including board mounting and press-fit. We can also flexibly accommodate connectors from other manufacturers. If you have any issues with board assembly or enclosure assembly, please feel free to consult with us.

  • Other semiconductors

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Development and prototyping environment for semiconductor packaging - equipment/devices

We have a variety of equipment necessary for development prototypes and evaluation analysis environments!

We have our own factory with a clean room located at our headquarters in Yokohama City. To conduct responsible development with an eye on quality, productivity, and cost during mass production, we are building an environment that allows for manufacturing verification, prototyping, and small-scale production.

  • Contract manufacturing

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Circuit board design, manufacturing, and assembly services.

We provide a one-stop service for optimal electronic device contract manufacturing by collaborating with partner companies that have unique features.

Our company offers "circuit board design, manufacturing, and assembly services." We accept comprehensive orders from printed circuit board design to board production and assembly (mounting). By collaborating with specialized companies for board production and assembly, we can deliver the finished product to our customers, achieving a reduction in labor and shortening delivery times. 【Features】 ■ Quick delivery ■ Re-manufacturing from raw printed circuit boards ■ High quality for peace of mind *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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COB high-density packaging contract manufacturing *Case study materials available for problem-solving

We accept module development, prototyping to evaluation, and mass production! We offer proposals with our unique know-how. *We are currently providing helpful materials such as the "High-Density Implementation Specification Sheet" and "Problem-Solving Case Studies."

We utilize the technology accumulated through various achievements to propose unique design and implementation know-how, covering package structures, joining methods, and material selection. We support flip chip technologies such as C4 joining, thermal compression bonding using NCP resin, ultrasonic GGI joining, and Au-Au thermal compression bonding. Additionally, we accommodate wire bonding using Au and AI wires, considering loop shapes for multi-stage and long-length wire bonding. We also offer contract development services, including substrate procurement. 【Features】 ■ Support for module development, prototyping to evaluation, and mass production ■ Proposals based on unique know-how in joining methods and material selection ■ Support for wire bonding and flip chip bonding ■ Information on other contract development services is also available *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other mounting machines

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Hybrid implementation service of COB and SMD | Achieving miniaturization and high functionality

Are you having trouble with COB and SMD on separate lines? Optimize costs and processes with consolidated mixed loading! *One-stop support from prototypes.

Are you having trouble with mixed COB and SMD mounting? Our company offers hybrid technology that allows for high-precision mounting of COB (Chip On Board) and SMD (Surface Mount Devices) on the same substrate. In module products that are becoming smaller and more functional, we simultaneously achieve space-saving, high reliability, and thermal design compatibility. We have a proven track record in various industries, including LED modules, sensors, and medical and automotive devices. We can provide one-stop support from design and prototyping to mass production. Please feel free to consult with us! 【Features】 ■ Comprehensive support for COB + SMD mixed mounting ■ Suitable for compact, high-density circuit design ■ Many achievements in LED, sensor, and automotive modules ■ Prototypes and short delivery times are acceptable 【Use Cases and Expected Applications】 ■ Development of compact, high-output LED modules ■ Spatial optimization design on IoT sensor boards ■ Ultra-compact mounting for medical probes and wearable devices *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other mounting machines

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